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Tracking Settling of CMP Slurries with the ViewSizer 3000

Measuring the amount of oversize agglomerates for CMP slurries is crucial in maintaining the polishing performance in semiconductor fabs. Large particle counters struggle to count sizes below 500 nm, while particle sizing techniques like dynamic light scattering struggle to have enough resolution to see tails of the distribution above the main peak.

In this application note, a silica slurry (D50 around 155 nm) was centrifuged for varying lengths of time to simulate the effects of long-term settling and track the disappearance of the ~200 nm tail end of the distribution.