Non-destructive thickness and composition analysis of NiP/Au plating on Cu contacts using micro-XRF
We carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a HORIBA X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.
HORIBA제품의 자세한 정보를 원하시면, 아래의 양식에 내용을 입력을 부탁드립니다.