Semiconductor Process
Material Analysis
Lithography Process
Achieves dramatic cost reductions in advanced mask inspections
Low running costs thanks to a compact design, plus remarkable versatility
For use in combination with Manufacturing Devices. Low-cost reticle/mask particle inspection with enhanced versatility and compactness.
DI Water Analysis (Wet Process)
Measure the ultra-low density of silica at the finest sensitivity of 0.01 µg/L (0.01 ppb).
Material Analysis (Particulates Analysis & Defect Analysis)
High spectral resolution analytical Raman microscope for ultimate performance and flexibility; includes UV Raman configuration, full automation and wide range of accessories.
Le GD-Profiler 2™ permet l’analyse simultanée de tous les éléments y compris les gaz (azote, oxygène, chlore, hydrogène). Il est l’outil idéal pour la caractérisation des surfaces, des couches minces, des dépôts et le suivi de productions.
Chemical Analysis (Wet Process)
Support for multi-batu, single-bath, and dingle-wafer cleaning systems
High-speed response and compact profile of the CS-131, SC-1 (standard clean) Solution Concentration Monitor makes it the ideal choice for single wafer and batch type cleaning devices.
High-speed response and compact profile make the SC-2 Solution Concentration Monitor the ideal choice for wafer and batch-type cleaning devices
High-speed response and compact profile make the SPM Solution Concentration Monitor the ideal choice for water and batch type cleaning devices
The CS-137 offers reliable, unobtrusive round the clock, real-time monitoring of BHF solution concentrations primarily used for wet etching in semiconductor processes.
24-hour real-time monitoring of HF/HNO3 solution concentrations in semiconductor wet-etching processes
24-hour real-time monitoring of FPM solution concentrations in semiconductor wet-etching processes
High-speed response and compact profile make the TMAH/H2O2 Solution Concentration Monitor the ideal choice for wafer and batch type cleaning devices
Ideal for hydrofluoric acid monitoring in semiconductor manufacturing
Ideal for ozone fluid density control in semiconductor production processes
This dissolved ozone concentration monitor is able to cover a broad measuring range from low concentrations to high concentrations.
High precision liquid mass flow controller using the sensor with a unique cooling method. Can control from micro-liter to ultra low flow rate.
Resistivity meter having the 2-channel carbon sensor. Measurement range: 0 - 100.0 MΩ・cm
Carbon sensor resistivity meter. Measurement range: 0 - 100.0 MΩ・cm
Compact resistivity meter for versatile porpose. Measurement range: 0 - 100.0 MΩ・cm
High precision, high-speed measurement of low concentrations of HF, HCl, and NH3. Resistance sensor.
Gas Control/Analysis (Dry Process)
The best-selling digital mass flow controller offering multi range/multi gas solutions. High accuracy, fast response, and compact size. All metal.
The UR series automatic pressure regulators are electronic regulators with high-precision pressure sensors and ...
Best-selling, compact baking system suitable for a range of liquid source delivery applications. Easy maintenance.
The compact vaporization system does not require carrier gas, it can be used with either a liquid or gas flow meter, allowing for easy integration for direct liquid injection.
Automatic liquid refill system delivers chemicals directly to baking or direct liquid injection systems. Safe, efficient, and continuous supply of liquid sources.
High stability and accuracy pressure controller for back side wafer cooling in semiconductor manufacturing, installed piezo actuator valve and pressure sensor.
Vaporize liquid source stably by the gas-liquid mixture vaporization method. Can be used for low temperature and large flow production.
Process Monitoring (Dry Process)
Compact process gas monitor using quadrupole mass spectrometer. Monitors trace gases, responds quickly to process shift . Easy to install and maintain.
Thin Film Control/Analysis
Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.
Real Time Interferometric Process Monitor provides high precision detection of film thickness and trench depth during the etching/coating process.Interference occurs when monochromatic light hits the sample surface, resulting in...
Emission analysis type end-point monitor intended for end-point detection or plasma condition control in the plasma-based semiconductor thin-film process.
Produits : UVISEL VIS : 210-880 nm | UVISEL FUV : 190-880 nm | UVISEL NIR : 245-2100 nm | UVISEL ER : 190-2100 nm |
Idéal pour la caractérisation des couches minces en recherche et développement.
CMP Process
Particle size distribution analyzers, which determine both the size of particles and their state of distribution, are used for the production control of powders in such fields as ceramics, chemistry, and foodstuffs. The LA-920,...
Les granulomètres de la série LA utilisent la théorie de diffusion de Mie (diffraction laser ) pour mesurer la taille des particules de suspensions ou poudres sèches. La rapidité et la facilité de mise en oeuvre de cette technique en font la plus populaire pour nombre d’ applications.
Le granulomètre LB-550 utilise la technique de diffusion dynamique de la lumière et permet de mesurer des solutions concentrées, jusqu’à 40% en poids, sur une large gamme de 1nm à 6 microns.