Mass Flow Module
Real-time endpoint detection in plasma etching is essential for improving yield. The Plasma Emission Monitor EV 2.0 can reliably detect endpoints even on low open-area wafers by combining a high-performance spectrometer with a robust endpoint algorithm.
The LEM Series Laser Interferometer is suitable for monitoring trench depth, from shallow to deep trenches. By selecting the appropriate wavelength, it can be used in a wide range of applications, including the processing of optoelectronic devices such as laser diodes, where etch depth directly affects device characteristics.
The LG-100 Series Laser Gas Analyzer measures changes in the partial pressure of SiF4 generated during semiconductor etching in real time. Based on these changes, it determines whether the etch has reached the endpoint. Leveraging HORIBA’s proprietary IRLAM infrared gas analysis technology, it directly measures trace gases with a response time of less than 0.1 seconds, helping reduce under-etching and over-etching and improve productivity and yield.
*Infrared laser absorption modulation method (IRLAM™: Infrared Laser Absorption Modulation)
*IRLAM is a registered trademark or trademark of HORIBA, Ltd.
Mass flow controllers (MFCs) measure and control fluid mass flow and are widely used in semiconductor processes and other applications that require highly precise flow measurement and control. As the latest addition to the CRITERION™ Series, HORIBA developed the Digital Mass Flow Module D700 to further enhance customer satisfaction through advanced fluid measurement and control.
High-speed response, high-precision Mass Flow Module D700MG
Shortening gas exchange time in the chamber is a critical issue in high-speed, continuous processes. The High-speed Response, High-precision Mass Flow Module D700MG uses a high-speed valve drive circuit and a newly developed control algorithm to achieve industry-leading startup control within 0.1 seconds. This shortens gas exchange time in the chamber and helps improve productivity and equipment operating efficiency.
Wide-range Mass Flow Module D700WR
Conventional systems required separate MFCs for high-flow and low-flow control in gas lines using the same gas type. The Wide-range Mass Flow Module D700WR provides a broad control range from 0.1% of full-scale flow, making it possible to replace two MFCs with one. By reducing the number of MFCs and improving gas-line efficiency, it helps deliver better performance and lower costs in applications using multiple gas types.
Micro Mass Flow Module D700uF
In etching processes for advanced devices, even very small changes in process gas flow rates of 5 SCCM or less can significantly affect yield. The D700uF Micro Mass Flow Module delivers precise control down to an industry-leading minimum of 0.025 SCCM. With dedicated components and a newly developed flow reference unit, it enables highly accurate measurement and control of critical gases, helping improve performance and process stability.
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