Application for Semiconductor Manufacturing Process

Author: Hideyuki KOISHI; President & CEOHORIBA STEC, Co., Ltd., Senior Corporate Officer HORIBA, Ltd. – Abstruct: “Measurement” makes vague and ambiguous matters clarified. The HORIBA Group contributes to human society through measuring technologies related to the environment, health and life. In particular, HORIBA STEC, Co., Ltd. (HORIBA STEC) contributes to the development of the industry by evolving the technologies for accurate measurement and control of fluids.

Author: Seiji USUI; Managing Director HORIBA STEC, Co., Ltd., Junior Corporate Officer HORIBA, Ltd. – Abstruct: HORIBA has put many products out into the world as a manufacturer specialized in analyzers since the establishment of HORIBA, Ltd., in 1953. Since then, based on a wide variety of analysis measurement technologies we have cultivated, we have developed products, giving the first priority to meeting customer needs and applications and offering optimum products in each field. Currently, we are developing business with a focus on our analysis measurement technologies in the following five business fields: Automotive measurement, Environment and process, Science, Medical purpose, and Semiconductor (Figure 1).

Author: Takeshi KAWANO; Corporate Officer & General Manager of Research & Development Division, HORIBA STEC, Co., Ltd. – Abstruct: HORIBA STEC, Co., Ltd., marketed the purely domestic Mass Flow Controller (hereinafter referred to as “MFC”) for the first time in Japan in1980. After that, the SEC-400 series and SEC-4400 series of MFCs were released, and their performance and quality were recognized by customers of semiconductor manufacturing tool manufacturers and semiconductor device manufacturers all over the world. So far, we have continuously developed and commercialized MFCs required in semiconductor processes. Today, semiconductor process-related products offered by HORIBA STEC Co., Ltd., are not only limited to MFCs but are also used in the measurement and control of flow, pressure, and concentration around process chambers. To provide solutions to customers, the number of products we offer as modules and subsystems, as well as parts and components, is increasing.

Author: Hiromichi ENAMI; Hitachi High-Technologies Corporation – Abstruct: In current and future semiconductor wafer manufacturing, CVD (Chemical Vapor Deposition)/ ALD (Atomic Layer Deposition) and Dry Etch are becoming key technologies. These technologies are utilized increasingly and are widely implemented due to feature size reduction and 3D structures requirements. In addition, there are Multiple competing requirements that are difficult to realize without these technologies but they are still insufficient and far from maturity. Therefore, the performance and capabilities of these technologies must be continuously improved. An innovative process sensing system and a fluctuation-free gas supply offer promising means to improve performance. In order to achieve this, collaboration and close development between equipment users, equipment suppliers, subsystem OEM (Original Equipment Manufacturer), and system solution providers is required and should be maintained.

Author: Yasuhiro ISOBE; Fukuchiyama Technology Center, HORIBA STEC, Co., Ltd. – Abstruct: Higher accuracy and reliability for gas flow and liquid material supply are requested with the miniaturization and high integration of leading edge semiconductor device. To meet the requirement, at Kyoto Fukuchiyama technology center, we aim to establish flow standard technologies that are to develop flow standards, to standardize method of process gas flow measurement and to be accredited to ISO/IEC 17025 as a flow calibration authority. In this issue, we introduce our efforts for standardization of flow standard technology

Author: Kentaro NAGAI; Development Design Dept. 1, HORIBA STEC, Co., Ltd. – Abstruct: Recently, with the increase of IoT applications for semiconductor devices, it is important to minimize process system downtime at front-edge device factories. Therefore parameters are increasing and criteria are tightening in their process line control, to detect system or component failures before their process execution. In order to satisfy these criteria, not only higher process gas flow control accuracy, minimal instrumental error, and pressure resistant flow control, but also high speed control communication and early anomaly detection are required for recent mass flow control modules. D507 series is newly lined up on D500 series to meet these strict specifications at recent semiconductor factories.

Author: Daisuke HAYASHI; Development Design Dept. 3, HORIBA STEC, Co., Ltd., Ph.D. – Abstruct: Vapor concentration of bis-cyclopentadienyl magnesium, which is used for fabrication of gallium-nitride semiconductor devices such as blue light-emitting diodes, was measured by using non-dispersive infrared (NDIR) spectroscopy. Different from conventional NDIR measurements, infrared absorbance at 12.8μm corresponding to C-H bending motion was utilized. From the measurement results, it becomes obvious that the vapor concentration was largely different from the concentration calculated from the saturation vapor pressure, and that the concentration and its dependence on carrier flow rate could be varied according to bubbler bottles. In this article, the detail of measurement technology along with experimental results is described.

Author: Makoto MATSUHAMA; Advanced R&D Center, HORIBA, Ltd. – Abstruct: Concerning the dry process of the semiconductor device manufacturing, the monitoring of etching chamber conditions (pressure, temperature, gas concentration, ...) is crucial. This time, as a study of a new application, we examined the etching chamber management by using the residual gas analyzer. Generally using a residual gas analyzer in a dry etching apparatus which uses halogen-containing gas has been being avoided because of concerns such as sensors life. By confirming the residual gas component in the chamber before etching, it was possible to illuminate the cleaning process.

Author: Yoko NAKAI; Application Development Dept., Research & Development Division, HORIBA Advanced Techno, Co., Ltd. – Abstruct: HORIBA’s CS-Series chemical concentration monitors that use ultraviolet (UV) and near-infrared (NIR) absorption spectroscopy are widely used in semiconductor wet processes, and make it possible to measure multiple components in line and in real time. The monitor can measure various types of samples, from general ammonia and hydrogen peroxide mixtures in semiconductor cleaning processes to 5-component chemistry including by-products from etching and metal ions in solutions, and things like CMP slurries including solid particles. This paper will introduce specific examples of applications.

Author: Riichiro SUZUKI; Research & Development Division, HORIBA Advanced Techno, Co., Ltd. – Abstruct: HORIBA developed 2-pole electrical conductivity sensors with chemical-resistant carbon electrodes in 2002. These sensors are installed in semiconductor wet processes and are put into practical use as densitometers. In addition, HORIBA developed a new circuit for 4-pole conductivity measurement, which was an innovation that improved the precision with any 4-pole sensors. Concentration of single-component such as hydrofluoric acid or TMAH are measured based on precise electrical conductivity and temperature measurements. Temperature compensation calculations for the conductivity of the individual component are necessary to convert the conductivity into the concentration. Etching and developing solutions, etc. need to be controlled at a constant level, and the demand for various types of densitometers that use electrical conductivity systems is increasing.

Author: Kentaro INOUE; Application Development Dept., Research & Development Division, HORIBA Advanced Techno, Co., Ltd. – Abstruct: The HD-960L dissolved oxygen monitor was launched for etching chemicals (HF and TMAH aqueous solutions) in semiconductor wet processes. The polarographic sensor has a guard electrode to improve the response in the low-concentration range. Optimizing the concentration of the electrolyte solution volume and configuring a current-restricting resistor for the guard electrode made it possible to measure high-temperature solutions and extend the life of the electrolyte solution. The evaluation test results showed that the saturated dissolved oxygen signal is not affected even if the chemical concentration changes, that the response to the concentration changing in the low-concentration range was fast enough, and that the signal was linear with respect to the concentration. A magnetic stirrer was installed in the flow chamber, which made it possible to take stable measurements of the dissolved oxygen, even in cases of samples with low flow rates.

Author: Sotaro KISHIDA; Development Design Dept. 2, HORIBA STEC, Co., Ltd. – Abstruct: In the deposition process or an etching process that made to be used for the fabrication of LEDs, semiconductors, FPDs and solar cells, various gases are used and the process pressure gives large effect on product quality, so the excellent corrosion resistance, and without gas dependent, and high accuracy are required to vacuum gauge . To provide solutions to these requests, HORIBA STEC has developed the Capacitance Diaphragm Gauge “VG-200 Series”, and the results of the performance evaluation were superior reproducibility and long term stability. Here, we describe the product features and performance evaluation results of the VG-200.

Author: Tomohiro SASAKI; Development Design Dept. 3, HORIBA STEC, Co., Ltd.; T. WATANABE; T. IHARA; T. YOSHIMURA; S. NARUKAMI – Abstruct: In order to ensure international consistency of analytical values, it is necessary to assure metrological traceability to international system of units (SI), whereas most of organic standard materials are not assured SI-traceability. New system, Standard Materials Calibration System, was developed in collaboration with HORIBA STEC Co., Ltd. and National Institute of Advanced Industrial Science and Technology (AIST). In this report, we studied new determination method which was easy and quick to assure SI-traceability to various analytes using this system.